
Right here’s an attention-grabbing tidbit from right now’s flurry of bulletins tied to Apple’s new $100 billion American Manufacturing Program: the corporate is coming into a brand new chip manufacturing partnership with Samsung. Listed here are the small print.
New tech for brand spanking new chips
In line with Apple, they’re working with Samsung’s Austin, Texas facility, to deliver to the U.S. “an progressive new know-how for making chips, which has by no means been used earlier than wherever on the planet”.
Within the press launch, Apple doesn’t specify what this new know-how is, however says that the Austin facility “will provide chips that optimize energy and efficiency of Apple merchandise, together with iPhone gadgets shipped everywhere in the world.”
Right here’s Apple’s full assertion:
Apple can be working with Samsung at its fab in Austin, Texas, to launch an progressive new know-how for making chips, which has by no means been used earlier than wherever on the planet. By bringing this know-how to the U.S. first, this facility will provide chips that optimize energy and efficiency of Apple merchandise, together with iPhone gadgets shipped everywhere in the world.
Whereas that’s not a lot to go on, there may be hypothesis suggesting that Samsung (moderately than Sony) will provide Apple with next-generation ISOCELL digicam sensors, constructed on the similar Austin facility.
And whereas digicam sensors aren’t usually described as parts that “optimize energy and efficiency,” that is in the end a rigorously worded press launch made to appease and make the present U.S. administration look good, so a little bit of inventive framing could possibly be on the desk.
Be it as it could (and, once more, with out realizing the specifics), it’s attention-grabbing to see Apple flip to Samsung, moderately than TSMC, its main chip associate, and even Intel, which has been lobbying exhausting for foundry enterprise and authorities incentives, to pilot what it calls a “by no means been used earlier than wherever on the planet” chipmaking know-how on U.S. soil.
TSMC, for its half, has additionally just lately introduced plans to increase its complete funding within the U.S. to $165 billion, together with “three new fabs, two superior packaging services and an R&D middle” per the corporate’s personal press launch.
What do you suppose this new chip could possibly be? Tell us within the feedback.
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